AMAOE-SRMDM-Q1XW BGA Reballing Stencil (Intel Alder Lake-N FCBGA1264)
Product Code: AMAOE-SRMDM-Q1XW
Brand: AMAOE / AMOE
Warning: AMAOE stencils are designed for solder paste application only. Solder balls are not used.
Product Features
AMAOE-SRMDM-Q1XW is a BGA reballing stencil designed for Intel Alder Lake-N (FCBGA1264) processors. The stencil is marked “Alder Lake-N CPU Q1XW”. Dimensions: 70x70mm, Thickness: 0.20mm (T:0.20MM).
- Socket: FCBGA1264 (Alder Lake-N)
- Compatible Processors: Intel Core i3-N300, i3-N305, Core 3 N350 / N355, Processor N50 / N50L / N97 / N100 / N150 / N200 / N250 / N300 / N305
- Package Type: FCBGA1264
- Dimensions: 70x70mm
- Thickness: 0.20mm (T:0.20MM)
- Application: Alder Lake-N (FCBGA1264) processor reballing
Condition: NEW. Original.
Warranty: No warranty is provided for semiconductor products.
Important Notice: Stencil and similar metal/alloy products are carefully packed to prevent damage during shipping. Upon delivery, please open the package in the presence of the courier and take a damage report if any issue is found. We cannot accept responsibility for damages without an official report.
Shipping (Turkey): Orders placed on weekdays before 16:30 and on Saturdays before 14:30 are shipped the same day via contracted cargo. (Excluding peak periods and public holidays)
International Shipping: Orders placed on weekdays before 16:30 are shipped the same business day via Air Parcel. Orders placed on weekends and outside business hours are shipped on the following business day. (Excluding peak periods) Shipping country is Turkey.
