XZZ LENOVO-1 BGA Stencil - EC / IO / IC / LPDDR5 (T=0.15mm)

Product Code: XZZ-STENCIL-LENOVO-1 

Brand: XZZ 

Type: Brand Specific (Lenovo) Combo Stencil 

Product Features 

The XZZ LENOVO-1 Stencil is designed for reballing modern BGA package chips found in Lenovo laptop motherboards, including EC (Embedded Controller), IO, PMIC, and Embedded LPDDR5 memory chips. With a 0.15mm steel thickness (T=0.15mm), this stencil is optimized for standard BGA IO chips, ensuring perfect solder paste application.

Supported Chip Models on Stencil:

• MEC Series (ThinkPad EC): MEC1503-EA2 (117B5JA), MEC1503-EA2 (152649A), MEC1663-BAO, MEC1723-CBO, MEC1653-BA1
• IO / EC Controllers: IT8186VG-192 (ITE), KB9548GF2 (ENE), NPCX997KAABX (Nuvoton)
• Power & USB-C Chips: BD4178 (ROHM), PTPS65994 (TI TPS65994)
• Onboard Memory: K3LKBKBOBM-MGCP (Samsung LPDDR5 - FBGA315)

Technical Specifications:

• Product Type: Lenovo Motherboard Dedicated Repair Stencil 
• Thickness: 0.15mm (Ideal steel thickness for IO Chips) 
• Material: Stainless Steel Alloy 
• Manufacturing: Precision Laser Cut (Square and Round Holes) 

Sales Information 

Condition: NEW. Original. 

IMPORTANT NOTICE: Stencils and delicate metal parts are carefully packed to prevent damage during transit. However, please inspect the package in the presence of the courier upon delivery. If there is any damage, a report must be filed with the courier immediately. We do not accept liability for damages not reported with an official courier record. 

Shipping (Turkey): All orders placed before 16:00 on weekdays and 14:30 on Saturdays are shipped on the same day via contracted courier. (Except for busy periods) 

International Shipping: Orders placed before 16:00 on weekdays are shipped on the same business day via Air Parcel. Orders placed during weekends or outside business hours are shipped on the following business day. Shipping country: Turkey.