XZZ DDR Series Universal BGA Stencil - 0.25mm 

Product Code: XZZ-DDRSTENCIL-UNIV

Brand: XZZ 

Type: Universal RAM Stencil 

Product Features 

The XZZ DDR Series Universal BGA reballing stencil is specially designed for reballing fine-pitch (Micro-BGA) LPDDR and DDR5 memory chips used in modern mobile devices, tablets, and ultrabooks. Made of high-heat resistant Japanese steel alloy with a non-deforming structure, it ensures precise repair for all mobile memory chips utilizing 0.25mm solder balls.

Supported BGA Footprints & Memory Types:

• BGA-60: Mobile DDR / DDR2
• BGA-78: DDR3 / LPDDR3
• BGA-84: DDR2 / Mobile-DDR
• BGA-96: DDR3 / DDR4 (Standard)
• BGA-128: LPDDR2 / LPDDR3
• BGA-170: GDDR5 / GDDR6 / DDR5
• BGA-180: LPDDR4 / LPDDR5
• BGA-190: DDR5 / LPDDR5

Technical Specifications:

• Product Type: Universal Multi-RAM Stencil 
• Stencil Thickness: 0.25mm (LPDDR Standard) 
• Material: Stainless Steel Alloy 
• Manufacturing: Precision Laser Cut 
• Applications: Mobile Phone, Tablet, and Ultrabook Motherboard Repair 
• Package Content: 1x XZZ DDR Universal Stencil 

Sales Information 

Condition: NEW. Original. 

IMPORTANT NOTICE: Stencils and delicate metal parts are carefully packed to prevent damage during transit. However, please inspect the package in the presence of the courier upon delivery. If there is any damage, a report must be filed with the courier immediately. We do not accept liability for damages not reported with an official courier record. 

Shipping (Turkey): All orders placed before 16:00 on weekdays and 14:30 on Saturdays are shipped on the same day via contracted courier. (Except for busy periods) 

International Shipping: Orders placed before 16:00 on weekdays are shipped on the same business day via Air Parcel. Orders placed during weekends or outside business hours are shipped on the following business day. Shipping country: Turkey.