- Stock: In Stock
- Brand: XZZ (XinZhiZao)
- Model: XZZ-3DSTENCIL-INTEL-12-13-14-HX-SRLGK
XZZ 3D Stencil Intel HX Series FCBGA1964 Magnetic-Sensitive
Product Code: XZZ-3DSTENCIL-INTEL-12-13-14-HX-SRLGK
Manufacturer: XZZ (XinZhiZao)
Warning: Before purchasing, make sure the chipset in your hands is FCBGA1964 package and matches the product images.Product Features
Magnetic-sensitive 3D stencil manufactured for Intel HX series mobile processors. Used on 12th, 13th and 14th gen HX / HX Refresh processors. All of these processors are in FCBGA1964 package.
- Package Type: FCBGA1964 (Intel FC-BGA16F)
- Compatible Series: Intel 12th/13th/14th Gen HX and HX Refresh
- Feature: Magnetic-sensitive 3D stencil
- Application: HX series BGA reballing
Compatible Processors (with SR Codes)
The following list has been compiled from official Intel sources. All processors are in FCBGA1964 package.
- Intel Core i5-12450HX SRLGN FCBGA1964
- Intel Core i5-12600HX SRLGJ FCBGA1964
- Intel Core i7-12650HX SRLGM FCBGA1964
- Intel Core i7-12800HX SRLGL FCBGA1964
- Intel Core i7-12850HX SRLGH FCBGA1964
- Intel Core i9-12900HX SRLGK FCBGA1964
- Intel Core i9-12950HX SRLGG FCBGA1964
- Intel Core i5-13450HX SRME8 FCBGA1964
- Intel Core i5-13500HX SRME7 FCBGA1964
- Intel Core i5-13600HX SRME6 FCBGA1964
- Intel Core i7-13650HX SRMED FCBGA1964
- Intel Core i7-13700HX SRME5 FCBGA1964
- Intel Core i7-13850HX SRMEA FCBGA1964
- Intel Core i9-13900HX SRMEC FCBGA1964
- Intel Core i9-13950HX SRMEB FCBGA1964
- Intel Core i9-13980HX SRME9 FCBGA1964
- Intel Core i5-14450HX SRMXK FCBGA1964
- Intel Core i5-14500HX SRMXJ FCBGA1964
- Intel Core i7-14650HX SRMXH FCBGA1964
- Intel Core i7-14700HX SRMXG FCBGA1964
- Intel Core i9-14900HX SRMXF FCBGA1964
This list has been provided to you by Chipset Electronic Technologies Inc. from the official Intel sources. FCBGA1964 package.
Please compare the pictures before purchasing!
The product you are examining is only the 3D Stencil for Intel HX Series. It does not include Main Magnet and Spacer Frame.
You can also purchase the:
You can check Main Magnet by clicking here.
You can check Spacer Frame by clicking here.
3D Stencils consist of 3 parts.
1. Main Magnet (Base Magnet)
2. Spacer Frame (separate spacer frame for each chipset model)
3. 3D Stencil (separate 3D stencil for each chipset model) Intel HX Series (you are currently reviewing this product)
Application:
The chipset to be reballed is placed inside the spacer frame, then the 3D stencil is placed on top, and finally the Main Magnet is placed on top. In this way, the reballing process can be performed.
If solder balls are going to be used in the reballing process, the exit channel on the stencil makes it easier to remove excess balls.
Solder paste can also be used in the reballing process. However, this depends entirely on the technician's skill.
To view spacer frame and 3D stencil models, CLICK HERE.
Sales Information
Condition: NEW. Original.
Warranty: No warranty is provided for semiconductor products.
Important Information: Stencils and similar metal/alloy products are carefully packaged to prevent damage during shipping. Upon delivery, open the package in the presence of the cargo officer and a damage report must be prepared in case of any damage. We do not accept responsibility for damages without a report.
Shipping (Turkey): Orders placed until 16:30 on weekdays and 14:30 on Saturdays are shipped the same day with contracted cargo. (Excluding peak shipping periods and official holidays)
International Shipping: Orders placed before 16:30 on weekdays are handed over to Air Parcel on the same business day. Orders placed on weekends and outside business hours are shipped on the next business day. (Excluding peak periods) Country of origin: Turkey.
