3D STENCIL INTERMEDIATE PLATE AMD RYZEN STENCIL MIDDLE PLACING SYSTEM

The product you are examining is only the (STENCIL MIDDLE PLACING SYSTEM) accessory for AMD RYZEN Series. It does not include 3D Stencil and Main Magnet in its content.

You can also purchase the

MAIN MAGNET by clicking here

You can also purchase the Amd Ryzen 3D Stencil by clicking here.

You can have a better idea by reviewing the video below. 

3D Stencils consist of 3 parts.

1. Main Magnet (Base Magnet) 

2. Middle Placing Hole (Separate model middle placing hole for each chipset model. (You are currently reviewing this product)) 

3. 3D Stencil (Separate 3D stencil for each chipset model) 

Application: 

The chipset to be re-balled is placed inside the middle placing hole, then a 3D stencil is placed on top, and finally, the Main Magnet is placed on top. In this way, the reballing process can be performed.

If solder balls are going to be used in the reballing process, it will provide convenience when removing excess balls from the stencil channel.

Solder paste can be used in the reballing process. However, this depends entirely on the technician's skill.

To view middle placing hole and 3D stencil models, CLICK HERE. 

Video:

Manufacturer: OEM

Brand: ChipsetAS 

Condition: New, unused. Original.

Warranty : There is no warranty for stencil products.

IMPORTANT NOTICE: The stencil is carefully packaged to avoid damage during shipping, but it is necessary to open the package in the presence of the courier and create a report if there is any damage during delivery. We do not accept responsibility for damages without a report. 

Shipping:

All orders placed before 16:30 on weekdays are picked up by contracted courier company on the same day. Orders placed after 16:30 will be given to the contracted courier company on the next business day. International sales will be given to local post office to send with registered parcel.

(***Excluding busy courier periods, public holidays, conditions that may prevent the courier company from operating.)