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Fehonda® PCM8990 8.5W/mK 40x20x0.25mm Phase Change Pad

Fehonda® PCM8990 8.5W/mK 40x20x0.25mm Phase Change Pad
Fehonda® PCM8990 8.5W/mK 40x20x0.25mm Phase Change Pad
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Same day shipping until 16.30 O'clock (for Turkey only)
  • Stock: In Stock
  • Brand: Fehonda
  • Model: PCM8990-40x20x025
$8.82
Tax Included Price: $8.82

Fehonda PCM8990 8.5W 40x20x0.25mm Phase Change Pad 


Product Code: Fehonda PCM8990 8.5W/mK 40x20x0.25mm Phase Change Pad 

Manufacturer: Hunan Feihongda New Material Co., Ltd. | Shenzhen Feihongda Technology Co., Ltd. 

Distributor: Chipset Electronic Technologies Inc. is the first and only authorized distributor in Türkiye for Hunan Feihongda New Material Co., Ltd. | Shenzhen Feihongda Technology Co., Ltd. / Fehonda brands. 

What is PCM8990? 

  • PCM (Phase Change Material)-based Thermal Interface Material (TIM) with high thermal conductivity. 
  • Used instead of thermal grease and offers superior resistance to the pump-out effect commonly experienced with thermal greases. 
  • 0.25mm in thickness. 
  • When the temperature of the heat source reaches 52°C, it undergoes a phase change into a paste-like state (BLT). 
  • Provides high thermal conductivity in both pad and paste forms. 
  • Designed to spread uniformly across the surface, minimizing thermal resistance between the electronic component and the heatsink. 
  • Long-term reliability: Passed 1,000 hours of thermal aging at 150°C and 1,000 cycles of T/C-B testing. 
  • Low thermal impedance: <0.03 °C·cm²/W, making it ideal for high-performance devices. 
  • Suitable for a wide range of applications with competitive cost efficiency. 
  • Designed for superior thermal conductivity, PCM-8990 phase change pad is widely preferred across various industries for reliable and efficient heat transfer. 
  • Tested in accordance with ASTM D5470, ASTM D792, ASTM D374, ASTM D149, and UL94 standards. 

Manufacturer's Notes 

  • Manufacturer Shenzhen/Hunan Feihongda Technology Co., Ltd. holds ISO9001, ISO14001, and ISO45001 certifications and is currently in the application process for IATF16949 certification

Application 

  1. Carefully clean the surfaces to be joined, ensuring they are completely free of dust, dirt, grease, and any residue. 
  2. If the ambient temperature is high, the thermal pad may partially undergo phase change and adhere to the protective film. Therefore, before use, keep the sealed package in a freezer for approximately 10 minutes. 
  3. Cut the pad to match the size of the chip (DIE). Cutting it slightly larger is recommended. 
  4. Use the tear-off tab included in the package to easily remove one side of the protective film. 
  5. Carefully position the pad on the chip and gently press from one end to the other to ensure proper adhesion to the surface. 
  6. Use the second tear-off tab to remove the remaining protective film, then install the heatsink. 
  7. Once applied, the material reaches its minimum BLT (Bond Line Thickness) after the burn-in process. If the heatsink is removed afterward, the PCM cannot be reused and must be replaced with a new one. 

Condition: BRAND NEW. Original, in its packaging. 

Warranty: No warranty is provided for semiconductor products. Opened products are non-returnable and non-exchangeable. 

Shipping (Türkiye): All orders placed before 16:00 on weekdays and before 14:30 on Saturdays are shipped the same day via our contracted courier. (Except during peak shipping periods and extraordinary circumstances) 

International Shipping: Orders placed before 16:00 on weekdays are shipped the same business day via Air Parcel. Orders placed on weekends or outside business hours are shipped on the following business day. (Except during peak periods) Country of dispatch: Türkiye.

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