Fehonda PCM8550 8.5W 40x20x0.25mm Phase Change Pad

Product Code: Fehonda® PCM8550 8.5W/mK 40x20x0.25mm Phase Change Pad

Manufacturer: Hunan Feihongda New Material Co., Ltd. | Shenzhen Fehonda Technology Co., Ltd.

Distributor: Chipset Electronic Technologies Inc. - The first and only authorized distributor of Hunan Feihongda New Material Co., Ltd. | Shenzhen Fehonda Technology Co., Ltd. / Fehonda brands in Türkiye.

What is PCM8550?

• A high-performance Phase Change Material (PCM)-based Thermal Interface Material (TIM).
• Delivers 8.5W/mK thermal conductivity for efficient heat transfer in high-performance CPUs, GPUs and other electronic components.
• Designed as a replacement for thermal paste, offering superior resistance to the pump-out effect commonly associated with conventional thermal compounds.
• Features a thickness of 0.25mm.
• Transitions into its phase-change state at operating temperature, spreading uniformly across the contact surface to fill microscopic gaps and achieve minimum Bond Line Thickness (BLT).
• Combines the easy handling of a thermal pad with the thermal performance of thermal paste.
• Engineered to minimize thermal resistance between the processor and heatsink by filling surface irregularities.
• Provides long-term reliability and has successfully passed high-temperature aging and thermal cycling tests.
• Its low thermal impedance makes it ideal for high-power-density electronic applications.
• Suitable for laptops, desktop processors, graphics cards, mini PCs, industrial electronics and other high-performance cooling applications.
• Tested in accordance with ASTM D5470, ASTM D792, ASTM D374, ASTM D149 and UL94 standards.

Manufacturer Notes

• Shenzhen/Hunan Feihongda Technology Co., Ltd. holds ISO9001, ISO14001 and ISO45001 certifications and is currently in the application process for IATF16949 certification.

Application

1. Thoroughly clean all application surfaces, ensuring they are completely free of dust, dirt, grease and any other contaminants.
2. If the ambient temperature is high, the thermal pad may partially undergo phase transition and adhere to the protective film. Therefore, it is recommended to place the sealed package in a freezer for approximately 10 minutes before application.
3. Cut the pad to match the size of the chip (DIE). Cutting it slightly larger than the die is recommended.
4. Carefully remove one side of the protective film using the tear-off tab included in the package.
5. Place the pad carefully onto the chip and gently press from one side to the other to ensure full surface contact.
6. Remove the second protective film using the remaining tear-off tab, then install the heatsink.
7. After the initial installation, the material reaches its minimum Bond Line Thickness (BLT) during the phase-change process. If the heatsink is removed, the pad must not be reused. A new PCM pad should be installed for reassembly. 

Condition: BRAND NEW. Genuine. 

Warranty: Semiconductor products are not covered by warranty. Opened products cannot be returned or exchanged.

Shipping (Türkiye): All orders placed by 16:00 on weekdays and by 14:30 on Saturdays are shipped the same day via our contracted courier service. (Except during peak shipping periods and extraordinary circumstances.)

International Shipping: Orders placed before 16:00 (Türkiye time) on weekdays are shipped the same business day via Air Parcel. Orders placed on weekends or outside business hours will be shipped on the following business day. (Except during peak periods.) Country of origin: Türkiye.